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| (R) BAT54J / W / AW / CW / SW SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT DEVICE K NC A NC K A K2 K1 A K2 A K1 BAT54W DESCRIPTION Schottky barrier diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with different pining are available. K A2 A1 A1 K A2 A2 K1 BAT54AW K2 K2 A1 A2 K1 A1 BAT54CW SOT-323 BAT54SW A 86 K BAT54J SOD-323 ABSOLUTE RATINGS (limiting values) Symbol VRRM IF IFSM Ptot Tstg Tj TL Continuous forward current Surge non repetitive forward current Power dissipation (note 1) Tamb = 25C Maximum storage temperature range Maximum operating junction temperature * Maximum temperaturefor soldering during 10s tp=10ms sinusoidal SOD-323 SOT-323 - 65 to +150 150 260 C C C Parameter Repetitive peak reverse voltage Value 30 0.3 1 230 Unit V A A mW Note 1: for double diodes, Ptot is the total dissipation of both diodes *: dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth(j-a) 1/5 June 1999 - Ed: 2A BAT54J / W / AW / CW / SW THERMAL RESISTANCE Symbol Rth (j-a) Junction to ambient (*) Parameters SOD-323 SOT-323 (*) Mounted on epoxy board, with recommended pad layout. STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol VF * Parameters Forward voltage drop Tests conditions Tj = 25C IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR ** Reverse leakage current Tj = 25C Tj = 100C Pulse test : * tp = 380 s, < 2% ** tp = 5 ms, < 2% Value 550 Unit C/W C/W Min. Typ. Max. 240 320 400 500 900 1 100 Unit mV VR = 30 V A DYNAMIC CHARACTERISTICS (Tj = 25 C) Symbol C trr Parameters Junction capacitance Reverse recovery time Tests conditions Tj = 25C VR = 1 V F = 1 MHz Min. Typ. Max. 10 5 Unit pF ns IF = 10 mA IR = 10 mA Tj = 25C Irr = 1 mA RL = 100 Fig. 1-1: Forward voltage drop versus forward current (typical values, low level). IFM(A) 2.00E-2 1.80E-2 Tj=100C 1.60E-2 1.40E-2 Tj=25C 1.20E-2 Tj=50C 1.00E-2 8.00E-3 6.00E-3 4.00E-3 2.00E-3 VFM(V) 0.00E+0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 Fig. 1-2: Forward voltage drop versus forward current (typical values, high level). IFM(A) 5E-1 Tj=100C 1E-1 Tj=50C 1E-2 Tj=25C VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 2/5 BAT54J / W / AW / CW / SW Fig. 2: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 1E+2 Tj=100C Fig. 3: Reverse leakage current versus junction temperature. IR(A) 1E+4 VR=30V 1E+3 1E+2 1E+1 1E+0 1E-1 1E-2 1E+1 1E+0 Tj=25C Tj=50C 1E-1 VR(V) 0 5 10 15 20 25 30 1E-2 Tj(C) 0 25 50 75 100 125 150 Fig. 4: Junction capacitance versus reverse voltage applied (typical values). Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, e(Cu)=35m) C(pF) 10 F=1MHz Tj=25C Zth(j-a)/Rth(j-a) 1.00 = 0.5 5 = 0.2 0.10 = 0.1 2 Single pulse T VR(V) 1 1 2 5 10 20 30 tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 =tp/T tp 1E+1 1E+2 Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printedcircuit board FR4, copper thickness: 35m.) Rth(j-a) (C/W) 600 550 500 450 400 350 S(Cu) (mm ) 300 0 5 10 15 20 25 30 35 40 45 50 P=0.2W 3/5 BAT54J / W / AW / CW / SW PACKAGE MECHANICAL DATA SOT-323 DIMENSIONS A REF. A1 D Millimeters 0.8 0.0 0.25 0.1 1.8 1.15 1.8 0.1 0 2.0 1.25 0.65 2.1 0.2 2.4 0.3 30 1.1 0.1 0.4 2.2 0.031 0.0 0.010 Inches 0.043 0.004 0.016 0.010 Min. Typ. Max. Min. Typ. Max. A A1 b c b L 0.26 0.004 D E e H L 0.071 0.079 0.086 0.026 0.071 0.083 0.094 0.004 0.008 0.012 0 30 1.35 0.045 0.049 0.053 H E c e 4/5 BAT54J / W / AW / CW / SW PACKAGE MECHANICAL DATA SOD-323 DIMENSIONS REF. Millimeters Min. E H b A1 Inches Min. 0 0.01 0.004 0.06 0.044 0.09 0.004 0.004 Max. 0.046 0.004 0.017 0.01 0.071 0.057 0.106 0.02 0.016 Max. 1.17 0.1 0.44 0.25 1.8 1.45 2.7 0.46 0.41 A A1 D A 0 0.25 0.1 1.52 1.11 2.3 0.1 0.1 b c D c Q1 E H L Q1 L Ordering type BAT54W BAT54AW BAT54CW BAT54SW BAT54J Marking D73 D74 D77 D78 86 Package SOT-323 SOT-323 SOT-323 SOT-323 SOD-323 Weight 0.006g 0.006g 0.006g 0.006g 0.005g Base qty 3000 3000 3000 3000 3000 Delivery mode Tape & reel Tape & reel Tape & reel Tape & reel Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringementof patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5 |
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